Experienced Senior Failure Analysis and Reliability Engineer with over 22 years of experience in Semiconductor. Excellent reputation for resolving problems and improving customer satisfaction.
Overview
17
17
years of professional experience
4
4
years of post-secondary education
Work History
Senior Failure Analysis and Reliability Engineer
Ams Asia Inc
01.2019 - Current
Performs Full FA on devices from customer returns and production lot
Handles different FA equipment depending on the needs on the request
Interface with Product Engineering, QA, Assembly manufacturing, and design for
various product quality related issues
Interface with QA Headquarters on all Physical and Electrical Failure Analysis issues
Provide the technical capabilities to help customers solve technical problems in their
factories
Conduct electrical and physical failure analysis of customer returns, identify the root
cause of failure and respond with appropriate corrective actions
Technical customer support regarding failure analysis reports and miscellaneous
correspondence as required by the customers
Support Field QA/Application engineers in a timely manner
Support weekly MRB and production lines issue
Generate 8D report for the customer returns.
Failure Analysis Engineer
Allegro Microsystems Philippines Inc
03.2015 - 01.2019
Performs complete Failure Analysis in Automotive and Sensors product
Supports analysis for Customer Quality products
Provides SEM/EDX and CSAM analysis results
Performs 3D X-ray
Performs Cross section analysis using manual and semi auto micro-sectioning
equipment
Validates FA analysis before releasing the results
Provides reliable Failure Analysis results to help the requestor’s needs
Qualify new FA equipment and provides result of GR&R
Participate in qualification of new product from PE group
Assists Section Head in time of Audit
Performs training for all FA technicians
Supervises (16) sixteen FA technicians in performing analysis.
Department: Central Failure Analysis, Performs Full FA in all products of different Business Fulfillment groups
Uses Liquid Crystal Microscope (LCM) if the devices had shorted leakage
readings through curve tracer to check for the hotspot area
Uses Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX)
to provide SEM image and EDX analysis results that needs by the requestors
Checks voids and delamination using C-mode Scanning Acoustic Microscopy
(CSAM) machine that needs by the requestor
Provides Reliability and Failure analysis result to manufacturing operation that
adheres to corporate standards and customer requirement on time
Participate in the qualification of new products and equipment in order to ensure
the compatibility, compliance with quality standards and requirement
Ensures own activities complies with quality system standard requirements
Participates in Quality Improvement Competitions in order to improves and
increase productivity
Supervises and monitors staff in order to ensure that the department targets are
met whenever immediate supervisor is unavailable
Ensures continuous and smooth operation by providing required facilities to
performed reliability and failure analysis.
REL Laboratory Assistant
11.2005 - 07.2012
Education
Bachelor of Science - Electronics Engineering
Manuel S. Enverga University Foundation
01.2013 - 01.2014
BSECE - undefined
Accreditation Program (ETEEAP) - Industrial Electronics Technology
Meralco Foundation Institute
01.2000 - 01.2003
Skills
Knows how to operate and understands the function of the followingScanning Electron MicroscopeEnergy Dispersive X-rayScanning Acoustic MicroscopyXray / 3DIR scopeLeica EMTXPMicro-sectioning (Auto/Semi-auto)DecapsulationLiquid Crystal MicroscopeTemperature CyclingPressure Cooker TestHigh Temperature Reverse Bias TestThermal FatigueTemperature Humidity Bias TestHighly Accelerated Stress TestUnbiased Highly Accelerated Stress TestHigh and Low Temperature Storage LifeReflow (Heller)
Accomplishments
Creates reliability and laboratory test plan in accordance to its specifications
Performs 0-hr electrical measurements and mechanical assessments
Performs preconditioning for DUT mounting like SMD devices
Performs loading and unloading of samples on Reliability test equipment following work instruction per machine like Temperature Cycling (TC), Pressure
Cooker Test (PCT), High Temperature Reverse Bias Test (HTRB), Thermal
Fatigue (TFAT), Temperature Humidity Bias Test (THBS), Highly Accelerated
Stress Test (HAST), Unbiased Highly Accelerated Stress Test (UHAST), High and Low Temperature Storage Life (HTSL and LTSL)
Performs electrical post measurements at ATE in every read point
Generates summary of electrical measurements and analyze data using Percent shift analysis
Compiles all test results and generates preliminary reliability test information report
Compiles all test results and generates quality survey report upon test completion
Performs Construction Analysis (CONANA) of POWER department – EVI,
Physical Dimension measurement, Solderability, Wire Bon Strength, Bond Shear and Die Shear Test, Micros-sectioning
Builds strong cooperation and partnership with Reliability Engineering Group and
Failure Analysis
Assessment of product reliability focusing on the identification and timely elimination of design and processing deficiencies that degrade product performance and operating life expectancy
Performs required Reliability Test Request and deliver on time
Overall coordination and direction in the evaluation of products through
Engineering Test Request
Helps develop and validates device reliability due process change, new equipment, new materials or start up.
Professional Engineer | NPI Reliability Failure Analysis Team Lead at Foxconn Hon Hai Technology IndiaProfessional Engineer | NPI Reliability Failure Analysis Team Lead at Foxconn Hon Hai Technology India