Rafael Jose L. Guevara
Makati City, Metro Manila,00
Summary
Dynamic Quality and Engineering Department Manager at Texas Instruments with a proven track record in team leadership and process optimization across multiple operational and support functions. Achieved $M in cost savings through innovative engineering solutions and $M++ more through new product qualification and ramp. Skilled in technical problem solving and fostering a culture of accountability while driving significant improvements in product quality, operational efficiency and technology innovation.
Overview
11
11
years of professional experience
Work History
Quality Department Manager
Texas Instruments
Clark, Pampanga, Philippines
07.2025 - Current
- Managing and leading cross functional team of quality engineers including area ownership across all major functions within the company (Bump, Probe, Assembly and Test)
- Direct partner with the customer quality team in ensuring 100% customer quality and satisfaction
- Oversaw supplier quality management including review and optimization of incoming direct materials like leadframes and epoxy
Process Engineering Dept Manager - Assembly
Texas Instruments
Clark, Pampanga, Philippines
07.2024 - 07.2025
- Owner of process engineering across front of line upto end of line Assembly Engineering for QFN and WCSP packages
- Championed quality assurance efforts through process stability and strong corrective/preventive action integration, ensuring consistent delivery of high-quality products and services
- Site yield champion responsible for 3% overall assembly/test improvement in 2024 translating to $15M in cost attainment
- Key stakeholder in new product material robustness for first pass qualification success. In charge of manufacturing qualification completion for new product release to market timeliness
- Effective program management on high level material qualification (2nd sourcing, internal new design, new enabler, footprint conversions) translating to $10M cost savings in 2024
- Optimized workflows for non-conforming material disposition and generation mitigation for overall improved process efficiency
- Site innovation champion and promoter in charge of motivating teams for technical publications and IP (30% increase year on year)
Process Engineering Manager - QFN Die Attach
Texas Instruments
Clark, Pampanga, Philippines
09.2023 - 07.2024
- Process engineering manager for QFN die attach process focusing on standard pick and place, flip chip and multi stack die packages
- Improved die attach yield by 0.1% (epoxy stability, stack die alignment improvement, damaged leadframe)
- Championed robust solutions around key die attach challenges including solder crack and die chipping for improved quality
Process Engineering Manager - Wafer Bumping
Texas Instruments
Clark, Pampanga, Philippines
09.2021 - 09.2023
- Championed process stability across wet processes (resist stripping, wet etching, electroplating), ball attach and outgoing automated visual inspection (AVI)
- Overall Bump cost savings champion responsible for $4M in 2023 including programs surrounding chemical usage reduction, 2nd sourcing, new qualification as technology enabler, direct materials and spares
- Bump outgoing AVI yield improvement by 0.3% due to key problem solving and preventive action placement
- Owner of new product introduction and device ramp with first pass qualification success. Many of these technologies are key packages running in production today
Semiconductor Packaging Manager - Wafer Level Bump
Texas Instruments
Clark, Pampanga, Philippines
06.2020 - 09.2021
- Owner of wafer level technology development and execution supporting worldwide key programs focusing on QFN and WCSP packages
- Unique technology advancements in Bump integration on key packages involving sensor and power management through electromigration (EM) improvement
- Consistent supplier engagement for new material downselection and optimization
Semiconductor Packaging - Wafer Level Bump
Texas Instruments
Clark, Pampanga, Philippines
09.2016 - 06.2020
- Technical expert on wafer level electroplating and automated visual inspection. Elected into the technical staff (MGTS) in 2020
- Provided cross site technical leadership and support on ball drop new integration technologies in China
Leadership Development Rotation Program
Texas Instruments
Clark, Philippines And Maine, USA
06.2014 - 08.2017
- Early career acceleration program member involving a 3 year rotation across 3 different roles (Operations, international and support group functions)
- 1st role: New Product Introduction/Electroplating at Clark Bump: Key programs involved qualification of chip on glass (COG) technology as co-program manager involving $10M of investments
- 2nd role: Fab Yield Enhancement/Diffusion at Mainefab, Maine, USA: Key programs involved particle induced detection overall site improvement for data accuracy
- 3rd role: Semiconductor Packaging at Clark Assembly: Key programs involved downstream integration of new Flipchip QFN technology
Education
Bachelor of Science - Chemical Engineering
University of The Philippines Diliman
Manila04-2014
Skills
- Organization management and culture change
- Team leadership and accountability
- Strong quality and engineering principles
- Deep understanding on process yield
- Technical problem solving
- Innovation promotion
- People and talent development
Additional Information
Author of 20 granted TI patents to date
Timeline
Quality Department Manager
Texas Instruments
07.2025 - Current
Process Engineering Dept Manager - Assembly
Texas Instruments
07.2024 - 07.2025
Process Engineering Manager - QFN Die Attach
Texas Instruments
09.2023 - 07.2024
Process Engineering Manager - Wafer Bumping
Texas Instruments
09.2021 - 09.2023
Semiconductor Packaging Manager - Wafer Level Bump
Texas Instruments
06.2020 - 09.2021
Semiconductor Packaging - Wafer Level Bump
Texas Instruments
09.2016 - 06.2020
Leadership Development Rotation Program
Texas Instruments
06.2014 - 08.2017
Bachelor of Science - Chemical Engineering
University of The Philippines Diliman