Rafael Jose L. Guevara
Makati City, Metro Manila,00
Summary
Dynamic Quality and Engineering Department Manager at Texas Instruments with a proven track record in team leadership and process optimization across multiple operational and support functions. Achieved $M in cost savings through innovative engineering solutions and $M++ more through new product qualification and ramp. Skilled in technical problem solving and fostering a culture of accountability while driving significant improvements in product quality, operational efficiency and technology innovation.
Overview
11
11
years of professional experience
Work History
Quality Department Manager
Texas Instruments
07.2025 - Current
- Managing and leading cross functional team of quality engineers including area ownership across all major functions within the company (Bump, Probe, Assembly and Test)
- Direct partner with the customer quality team in ensuring 100% customer quality and satisfaction
- Oversaw supplier quality management including review and optimization of incoming direct materials like leadframes and epoxy
Process Engineering Dept Manager - Assembly
Texas Instruments
07.2024 - 07.2025
- Owner of process engineering across front of line upto end of line Assembly Engineering for QFN and WCSP packages
- Championed quality assurance efforts through process stability and strong corrective/preventive action integration, ensuring consistent delivery of high-quality products and services
- Site yield champion responsible for 3% overall assembly/test improvement in 2024 translating to $15M in cost attainment
- Key stakeholder in new product material robustness for first pass qualification success. In charge of manufacturing qualification completion for new product release to market timeliness
- Effective program management on high level material qualification (2nd sourcing, internal new design, new enabler, footprint conversions) translating to $10M cost savings in 2024
- Optimized workflows for non-conforming material disposition and generation mitigation for overall improved process efficiency
- Site innovation champion and promoter in charge of motivating teams for technical publications and IP (30% increase year on year)
Process Engineering Manager - QFN Die Attach
Texas Instruments
09.2023 - 07.2024
- Process engineering manager for QFN die attach process focusing on standard pick and place, flip chip and multi stack die packages
- Improved die attach yield by 0.1% (epoxy stability, stack die alignment improvement, damaged leadframe)
- Championed robust solutions around key die attach challenges including solder crack and die chipping for improved quality
Process Engineering Manager - Wafer Bumping
Texas Instruments
09.2021 - 09.2023
- Championed process stability across wet processes (resist stripping, wet etching, electroplating), ball attach and outgoing automated visual inspection (AVI)
- Overall Bump cost savings champion responsible for $4M in 2023 including programs surrounding chemical usage reduction, 2nd sourcing, new qualification as technology enabler, direct materials and spares
- Bump outgoing AVI yield improvement by 0.3% due to key problem solving and preventive action placement
- Owner of new product introduction and device ramp with first pass qualification success. Many of these technologies are key packages running in production today
Semiconductor Packaging Manager - Wafer Level Bump
Texas Instruments
06.2020 - 09.2021
- Owner of wafer level technology development and execution supporting worldwide key programs focusing on QFN and WCSP packages
- Unique technology advancements in Bump integration on key packages involving sensor and power management through electromigration (EM) improvement
- Consistent supplier engagement for new material downselection and optimization
Semiconductor Packaging - Wafer Level Bump
Texas Instruments
09.2016 - 06.2020
- Technical expert on wafer level electroplating and automated visual inspection. Elected into the technical staff (MGTS) in 2020
- Provided cross site technical leadership and support on ball drop new integration technologies in China
Leadership Development Rotation Program
Texas Instruments
06.2014 - 08.2017
- Early career acceleration program member involving a 3 year rotation across 3 different roles (Operations, international and support group functions)
- 1st role: New Product Introduction/Electroplating at Clark Bump: Key programs involved qualification of chip on glass (COG) technology as co-program manager involving $10M of investments
- 2nd role: Fab Yield Enhancement/Diffusion at Mainefab, Maine, USA: Key programs involved particle induced detection overall site improvement for data accuracy
- 3rd role: Semiconductor Packaging at Clark Assembly: Key programs involved downstream integration of new Flipchip QFN technology
Education
Bachelor of Science - Chemical Engineering
University of The Philippines Diliman
Manila04-2014
Skills
- Organization management and culture change
- Team leadership and accountability
- Strong quality and engineering principles
- Deep understanding on process yield
- Technical problem solving
- Innovation promotion
- People and talent development
Additional Information
Author of 20 granted TI patents to date
Timeline
Quality Department Manager
Texas Instruments
07.2025 - Current
Process Engineering Dept Manager - Assembly
Texas Instruments
07.2024 - 07.2025
Process Engineering Manager - QFN Die Attach
Texas Instruments
09.2023 - 07.2024
Process Engineering Manager - Wafer Bumping
Texas Instruments
09.2021 - 09.2023
Semiconductor Packaging Manager - Wafer Level Bump
Texas Instruments
06.2020 - 09.2021
Semiconductor Packaging - Wafer Level Bump
Texas Instruments
09.2016 - 06.2020
Leadership Development Rotation Program
Texas Instruments
06.2014 - 08.2017
Bachelor of Science - Chemical Engineering
University of The Philippines Diliman
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