7 years of experience in Test Hardware Engineering and Failure Analysis. Expertise in Wafer Level and Final Testing, focusing on MTTR, MTBF, and OEE. Proficient in software debugging, root cause analysis, implementing corrective actions, and effective teamwork.
GOLD EXCELLENCE AWARD (October 11, 2024)
As a Leader Presenter of the TQM Plus for the cost saving of 211k$.
GOLD EXCELLENCE AWARD (October 10, 2024)
As a Team Accountable of the TQM PLUS with Cost Saving of 140k$.
APPLAUSE AWARD (June 2024)
For the Resolution of LT1970 LTX Probe Part causing low yield on process wafer.